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3M ? Anisotropic Conductive Film 7371
Assembly Process Techniques (continued)
Tacking and Bonding Conditions
200
180
Procedure
Conditions
160
140
Tacking Conditions
Temperature (13)
Pressure
Time
Bonding Conditions
Temperature (13)
Pressure
Time (14)
60 - 90°C
1 - 15 kg/cm 2
~1 sec
140 to 170°C
10 - 20 kg/cm 2
10 - 20 sec
120
100
80
60
40
20
Thermode
Released
170 ° C x 15 sec
140 ° C x 10 sec
0
Final bonding must be done under heat and pressure,
0
2
4
6
8
10
12
14
16
with a typical desirable bond line temperature that
reaches at least 140°C after 10 seconds at a pressure
of at least 10kg/cm 2 (see Table above). This has been
achieved using a total bond time of 10-20 seconds
where over the first 3-5 seconds the adhesive ramps
Time (sec)
Figure 1. Graph of ACF temperature vs. time profile
showing typical examples of bonding cycle.
Predicted 3M? ACF 7371 Cross-link Reaction
quickly to near the target temperature and over the last
5-17 seconds the temperature reaches between 140°C
100%
90%
140.0°C
150.0°C
160.0°C
170.0°C
180.0°C
190.0°C
and 170°C. (15) A plot of the temperature vs. time profile is
shown in Figure 1. Electrical contact between the circuits
is typically achieved shortly after the thermode is pressed
against the parts. Additional time at temperature is
necessary to cross-link the thermoset-elastomer material
80%
70%
60%
50%
40%
30%
20%
10%
0%
to generate peel strength and the ultimate reliability.
0
10
20
30
Time (sec)
40
50
60
Bond times may vary depending upon the substrates to
be bonded. (Optionally, for maximum mechanical and
electrical performance, the pressure may be maintained
while cooling to below 100oC. This increases the total
bond time. The time required to drop adhesive bond-line
temperature below 100oC is highly dependent on the
Figure 2. Graph of predicted cross-link reaction
compared with bonding temperature and time.
A comparison of the predicted level of cross-link reaction
across a range of bonding temperature and bonding time
is shown in Figure 2.
bonding equipment used.)
Repair
(13)
(14)
(15)
Temperature measured in the adhesive. Thermode set points will be higher
and will depend upon the substrate materials and bonding equipment. A
typical set-up for tacking is a setpoint temperature of 125oC. Typical set-up
for a flex circuit to polyester touch screen bond is a thermode temperature of
250oC and bonding time of at least 10 seconds (see next note).
The required minimum bonding temperature is usually reached at the
endpoint of bonding time. The optimum bonding temperature and time may
be different depending on customer application and design. Also, it may
be desirable to hold pressure while cooling to below 100oC for maximum
performance.
Bonding temperature up to 190°C has been shown to be acceptable for
3M? Anisotropic Conductive Film 7371.
(3)
Bonds made with 3M? Anisotropic Conductive Film
7371 may be repairable. The method for successful
rework can show considerable variation for different
design applications, process parameters, and
equipment capabilities. Contact your local Tech Service
Representative for further information.
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